FURI | Spring 2019
Comparative Segmentation in Lead-Free Solders for Damage Mitigation in Microelectronics
The main motivation is that lead-free solder (SnCu) are used extensively in microelectronics. There are risks associated with replacing lead solders with SnCu because they are not well understood so it is beneficial to study them for future application.
Images were rendered in the Scanning Electron Microscope (SEM) of SnCu solder. The final samples were single crystal and bicrystal SnCu subjected to electromigration and thermal aging. The single crystal slow diffusion demonstrates small and spherical grain activity. The single crystal fast diffusion had dense and non-spherical grains. The bicrystal slow and fast diffusion behaves similarly along a grain boundary.
Mentor: Marion Branch, Nikhilesh Chawla