MORE | Fall 2019
Phase-field modeling of electromigration-mediated hillock growth in copper interconnects
- Verifying Glickman’s model
- Devising a phase-field model for copper interconnects subjected to stresses and a normal electric field.
- Predicting morphological evolution of hillocks as a result of electromigration in these interconnects
Materials science and engineering
Hometown: Hyderabad, TL, India
Graduation date: Spring 2020